Ams AG

ams OSRAM unveiled a breakthrough 850 nm Thin-Film VCSEL platform for AI scale-up interconnects and is demonstrating a connectorized multi-core fiber solution with BizLink at ECOC 2026 in Malaga. The platform combines top-emission Thin-Film VCSELs, dense 25 m pitch microVCSEL arrays with addressability, silicon TSV integration and compatibility with standard multimode fiber infrastructure, and the company has completed microVCSEL integration on silicon TSV substrates with error-free 32 Gb/s NRZ operation at an energy efficiency of approximately 0.25 pJ/bit. Reliability testing showed no failures after more than 2,000 hours under elevated junction temperatures and current overstress conditions. BizLink joins ams OSRAM's wide-and-slow optical interconnect ecosystem as a specialist in optical connectivity and connector solutions, supporting the ECOC 2026 demonstrator, which will be shown in a private setting for selected customers and industry partners. The technology builds on the same core platform behind EVIYOS, and ams OSRAM is advancing fully integrated 3D photonics stacks combining microVCSEL arrays, micro-photodiode arrays and mixed signal CMOS electronics.