002402.CS2
H&T Plans to Issue Up to 2.2 Billion Yuan in Sci-Tech Innovation Exchangeable Corporate Bonds
H&T announced that its board of directors has approved a plan for a private placement of sci-tech innovation exchangeable corporate bonds, with a total issuance amount of no more than 2.2 billion yuan and a term of no more than three years. After deducting issuance expenses, the proceeds are intended to be used to repay bank loans. The underlying shares for the bonds are the A-shares of Chengchang Technology held by H&T. The proposal still needs to be submitted to the shareholders' meeting for review.
002402.CS · Capital · Neutral H&T plans to privately issue up to 2.2 billion yuan of sci-tech innovation exchangeable bonds to repay bank loans, pending shareholder approval.
001270.CS · · Neutral Chengchang Technology A-shares are the underlying for H&T's exchangeable bond; no company-specific development, only potential future share conversion.